SCOPUS 정보 검색 플랫폼

Microelectronic Engineering

Volumn 37-38, Issue , 1997, Pages 77-88

High aspect ratio quarter-micron electroless copper integrated technology (Invited lecture)

(2) Shacham Diamand, Yosi a Lopatin, Sergey a

a Cornell University (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COPPER; DIFFUSION IN LIQUIDS; ELECTROLESS PLATING; INTEGRATED CIRCUIT MANUFACTURE; MATHEMATICAL MODELS; METALLIZING; PHASE INTERFACES; REDOX REACTIONS; SILICON WAFERS; THIN FILMS; ULSI CIRCUITS;

COPPER METALLIZATION;

MICROELECTRONICS;

EID: 0031270393 PISSN: 01679317 EISSN: None Source Type: Journal
DOI: 10.1016/S0167-9317(97)00096-8 Document Type: Article

Times cited : (57)

References (11)

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