Stabilizer concentration and local environment: their effects on electroless nickel plating on PCB micropads

Journal of the Electrochemical Society

Volumn 146, Issue 8, 1999, Pages 2870-2875

  Zhang, S ^a   De Baets, J ^a   Vereeken, M ^a   Vervaet, A ^a   Van Calster, A ^a  

^a GHENT UNIVERSITY   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; CATALYSIS; CURRENT DENSITY; DIFFUSION IN SOLIDS; ELECTRIC FIELD EFFECTS; ELECTROLESS PLATING; ELECTRONS; FLIP CHIP DEVICES; LEAD; NICKEL; PRINTED CIRCUIT BOARDS; SURFACES;

CATALYTIC INHIBITOR; ELECTROLESS NICKEL PLATING; GALVANIC EFFECT; MICROPADS; POTENTIAL PINNING; STABILIZER CONCENTRATION;

STABILIZERS (AGENTS);

EID: 0032592441     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1392022     Document Type: Article

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