Numerical and experimental investigation of thermomechanical deformation in high-aspect-ratio electroplated through-silicon vias

Journal of the Electrochemical Society

Volumn 155, Issue 12, 2008, Pages

  Dixit, Pradeep ^a,b   Yaofeng, Sun ^b   Miao, Jianmin ^b   Pang, John H L ^b   Chatterjee, Ritwik ^a   Tummala, Rao R ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COPPER; COPPER OXIDES; DEFORMATION; ELECTROCHEMISTRY; ELECTROPLATING; FINITE ELEMENT METHOD; FORMING; INTERCONNECTION NETWORKS; NONMETALS; REACTIVE ION ETCHING; SHEAR STRAIN; SILICA; SILICON COMPOUNDS; THERMAL SPRAYING; THERMOMECHANICAL TREATMENT; THREE DIMENSIONAL;

BOTTOM-UP ELECTROPLATING; COEFFICIENTS OF THERMAL EXPANSIONS; CRACK FORMATIONS; CYCLIC LOADINGS; DEEP REACTIVE ION ETCHINGS; DEFORMATION MODES; DIGITAL IMAGE SPECKLE CORRELATIONS; EXPERIMENTAL ANALYSES; EXPERIMENTAL INVESTIGATIONS; FINITE ELEMENT MODELS; IN-SITU; NONCONTACT; SILICON INTERFACES; SILICON OXIDES; SILICON VIAS; THERMAL OXIDATIONS; THERMO-MECHANICAL; THERMOMECHANICAL STRESSES;

THERMAL EXPANSION;

EID: 54949129447     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2994154     Document Type: Article

References (32)

1. R. R. Tummala, IEEE Trans. Adv. Packag., 27, 241 (2004).
2. P. Dixit, J. Miao, and R. Preisser, Electrochem. Solid-State Lett., 9, G305 (2006).
3. J. U. Knickerbocker, P. S. Andry, L. P. Buchwalter, A. Deutsch, R. R. Horton, K. A. Jenkins, Y. H. Kwark, G. McVicker, R. J. Polastre, S. L. Wright, IBM J. Res. Dev., 49, 725 (2005).
4. L. Xu, P. Dixit, J. Miao, J. H. L. Pang, X. Zhang, K. N. Tu, and R. Preisser, Appl. Phys. Lett., 90, 033111 (2007).
5. J. Sun, K. Kondo, T. Okamura, M. Tomisaka, H. Yonemura, M. Hoshino, and K. Takahashi, J. Electrochem. Soc., 150, G355 (2003).
6. P. Dixit and J. Miao, J. Electrochem. Soc., 155, H85 (2008).
7. N. T. Nguyen, E. Boellaard, N. P. Pham, V. G. Kutchoukov, G. Craciun, and P. M. Sarro, J. Micromech. Microeng., 12, 395 (2002).
8. P. Dixit and J. Miao, J. Electrochem. Soc., 153, G552 (2006).
9. P. C. Andricacos, C. Uzoh, J. O. Dukovic, J. Horkans, and H. Deligianni, IBM J. Res. Dev., 42, 567 (1998).
10. P. Dixit, X. Chen, S. Divakaran, J. Miao, and R. Preisser, Appl. Surf. Sci., 253, 8637 (2007).
11. C. S. Selvanayagam, J. H. Lau, Z. Xiaowu, S. K. W. Zhang, K. Vaidyanathan, and T. C. Chai, in The 58th IEEE Electrical Components Technology Conference, IEEE, pp. 1073-1081 (2008).
12. L. Lei, Y. Shen, X. Chen, Q. Lihua, and K. Lu, Science, 304, 422 (2004).
13. P. Dixit, J. Miao, L. Xu, J. H. L. Pang, and R. Preisser, J. Micromech. Microeng., 17, 1749 (2007).
14. B. Z. Hong, J. Electron. Mater., 28, 1071 (1999).
15. Y. Wen and C. Basaran, J. Electron. Packag., 125, 134 (2003).
16. E. S. Ege and Y. L. Shen, J. Electron. Mater., 32, 1000 (2003).
17. P. Arunasalam, Z. Fan, H. D. Ackler, and B. G. Sammakia, in The 57th IEEE Electrical Components Technology Conference, IEEE, pp. 1179-1185 (2007).
18. D. W. Peterson, S. N. Burchett, J. N. Sweet, R. T. Mitchell, and L. Nguyen, in The 49th IEEE Electrical Components Technology Conference, IEEE, pp. 1241-1248 (1999).
19. Z. W. Zhong and P. K. Yip, Soldering Surf. Mount Technol., 15, 21 (2003).
20. F. Chan, G. M. Brown, and M. Song, Opt. Eng., 39, 10 (2000).
21. S. Ling and A. Dasgupta, in " Advanced Electronic Packaging ", 1, p. 1109, Center for Advanced Life Cycle Engineering, College Park, MD (1997).
22. M. Joodaki, G. Kompa, and H. Hillmer, IEEE Trans. Device Mater. Reliab., 5, 581 (2005).
23. S. Dilhaire, S. Jorez, A. Cornet, L. D. Patio Lopez, and W. Claeys, Microelectron. Reliab., 40, 1509 (2000).
24. S. Dilhaire, T. Phana, E. Schauba, and W. Claeys, Microelectron. Reliab., 38, 1591 (1998).
25. C. A. Walker, Exp. Mech., 34, 281 (1994).
26. R. O. E. Vijgen and J. H. Dautzenberg, Thin Solid Films, 270, 264 (1995).
27. D. Vogel, V. Grosser, A. Schubert, and B. Michel, Opt. Lasers Eng., 36, 195 (2001).
28. S. Xunqing, J. H. L. Pang, X. R. Zhang, Q. J. Liu, and M. Ying, IEEE Trans. Compon. Packag. Technol., 27, 659 (2004).
29. B. Wattrisse, A. Chrysochoos, J. M. Muracciole, and M. N. Gaillard, Exp. Mech., 41, 29 (2001).
30. T. C. Chu, W. F. Ranson, and M. A. Sutton, Exp. Mech., 25, 232 (1985).
31. H. Lu, J. Electron. Packag., 120, 275 (1998).
32. J. S. Lyons, J. Liu, and M. A. Sutton, Exp. Mech., 36, 64 (1996).