Thermomechanical stress analysis and measurement in Quasi-Monolithic Integration Technology (QMIT)

IEEE Transactions on Device and Materials Reliability

Volumn 5, Issue 3, 2005, Pages 581-593

  Joodaki, Mojtaba ^a,b,d,e   Kompa, Günter ^a,c,e,f   Hillmer, Hartmut ^c,g  

^a IEEE   (Germany)

^b Atmel Germany GmbH   (Germany)

^c UNIVERSITY OF KASSEL   (Germany)

^d INFINEON TECHNOLOGIES AG   (Germany)

^e SPIE ^*

^f German Ministry of Research and Technology (BMBF)   (Germany)

^g German Physical Society DPG   (Germany)

Author keywords

Finite element simulation; Quasi monolithic integration technology; RF packaging; Thermomechanical stress

Indexed keywords

ENHANCED QMIT STRUCTURE; FINITE-ELEMENT SIMULATION; QUASI-MONOLITHIC INTEGRATION TECHNOLOGY; RF PACKAGING;

COMPUTER SIMULATION; ELECTRIC CURRENTS; FINITE ELEMENT METHOD; INTERFEROMETRY; MICROWAVES; PELTIER EFFECT; THERMAL STRESS; THERMOANALYSIS;

MONOLITHIC INTEGRATED CIRCUITS;

EID: 29344441935     PISSN: 15304388     EISSN: 15304388     Source Type: Journal    
DOI: 10.1109/TDMR.2005.853580     Document Type: Article

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