Thermomechanical stress analysis of multi-layered electronic packaging

Journal of Electronic Packaging

Volumn 125, Issue 1, 2003, Pages 134-138

  Wen, Yujun ^a   Basaran, Cemal ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

APPROXIMATION THEORY; DELAMINATION; DIFFERENTIAL EQUATIONS; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; INTERFACES (MATERIALS); LAMINATES; MATHEMATICAL MODELS; MICROELECTRONICS; MULTILAYERS; STRESS ANALYSIS; THERMAL STRESS;

LAMINATED BEAM; MULTILAYERED MICROELECTRONICS; PLY LEVEL SUB-LAMINATE ANALYSIS; THERMOMECHANICAL STRESS;

ELECTRONICS PACKAGING;

EID: 0344119447     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1535446     Document Type: Article

References (32)

1. Timoshenko, S., 1925, "Analysis of Bi-Metal Thermostats," J. Opt. Soc. Am., 11, pp. 233-255.
2. Grimado, P. B., 1978, "Interlamina Thermo Elastic Stresses in Layered Beams," J. Therm. Stresses, 1, pp. 75-86.
3. Chen, W. T.; and Nelson, C., 1979, "Thermal Stresses in Bounded Joints," IBM J. Res. Dev., 23(2), pp. 179-188.
4. Suhir, E., 1986, "Stresses in Bi-Metal Thermostats," ASME J. Appl. Mech., 53, p. 657-660.
5. Suhir, E. 1986, "Stresses in Adhesively Bonded Bi-Material Assemblies Used in Electronic Packaging," Elect. Pack. Mat. Science-II, MRS Symp. Proc., pp. 133-138.
6. Suhir, E., 1986, "Stresses in Bi-Metal Thermostats," ASME J. Appl. Mech., 53(3), pp. 657-660.
7. Suhir, E. 1986, "Calculated Thermally Induced Stresses in Adhesively Bonded and Soldered Assemblies," Int. Symp. Microelect., pp. 383-392.
8. Suhir, E. 1987, "Stresses in Multilayered Thin Films on a Thick Substrate, Heteroepitacy-on-Silicon II," MRS Symp. Proc, 91, pp. 73-80.
9. Suhir, E. 1988, "An Approximate Analysis of Stresses in Multilayered Elastic Thin Films," ASME Winter Annual Meeting, WA/APM-14.
10. Suhir, E., 1989, "Interfacial Stresses in Bimetal Thermostats," ASME J. Appl. Mech., 56, 595-600.
11. Suhir, E. 1995, "Global and Local Thermal Mismatch Stresses in an Elongated Bi-Material Assembly Adhesively Bonded at the Ends," Symp. on Structural Analysis in Microelectronic and Fiber Optic Systems, 1195 ASME Winter Annual Meeting, EEP/12, pp. 101-105.
12. Pao, Y. H., and Eisele, E., 1991, "Interfacial Shear and Peel Stresses in Multilayered Thin Stacks Subjected to Uniform Thermal Loading," ASME J. Electron. Packag., 113, pp. 164-172.
13. Chen, D., Cheng, S., and Geerhardt, T. D., 1982, "Thermal Stresses in Laminated Beams," J. Therm. Stresses, 5, pp. 67-84.
14. K. Washizu, 1968, Variational Methods in Elasticity and Plasticity, Pergamon, New York, NY.
15. Williams, H. E., 1985, "Asymptotic Analysis of the Thermal Stresses in a Two-Layer Composite with an Adhesive Layer," J. Therm. Stresses, 8, pp 183-203.
16. Bogy, D., 1968, "Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loadings," ASME J. Appl. Mech., 35, pp. 460-466.
17. Bogy, D. B., 1970, "On the Problem of Edge-Bonded Elastic Quarter-Planes Loaded at the Boundary," Int. J. Solids Struct., 6, pp. 1287-1313.
18. Hein, V. L.; Erdogan, F., 1971, "Stress Singularities in a Two-Material Wedge," Int. J. Fract. Mech., 7(3), pp. 317-330.
19. Yin, W. L., 1991, "Thermal Stresses and Free-Edge Effects in Laminated Beams: A Variational Approach Using Stress Functions," ASME J. Electron. Packag., 113, pp. 68-75.
20. Lee, M., Jasiuk, I., 1991, "Asymptotic Expansions for the Thermal Stresses in Bonded Semi-Infinite Bimaterial Strips," ASME J. Electron. Packag., 113, pp. 173-177.
21. Shih, C. F., and Asaro, R. J., 1988, "Elasto-Plastic Analysis of Cracks on Bi-Material Interfaces Part I-Small Scale Yielding," ASME J. Appl. Mech., 55, pp. 299-316.
22. Shih, C. F., and Asaro, R. J., 1989, "Elasto-Plastic Analysis of Cracks on Bi-Material Interfaces: Part II Structure of a Small-Scale Yielding Fields," ASME J. Appl. Mech., 56, pp. 763-779.
23. Basaran, C., and Zhao, Y., 2001, "Mesh Sensitivity and FEA for Multilayered Electronic Packaging," ASME J. Electron. Packag., 123(3), pp. 218-224.
24. Pagano, N. J., 1978, "Stress Fields in Composite Laminates," Int. J. Solids Struct., 14, pp. 385-400.
25. Pagano, N. J., 1974, "On the Calculation of Interlaminar Normal Stress in a Composite Laminate," J. Compos. Mater., 8, pp. 65-82.
26. Whitney, J. M., and Sun, C. T., 1983, "A Higher Order Theory for Extensional Motion of Laminated Composites," J. Sound Vib., 30, pp. 85.
27. Rehfield, L. W., and Valisetty, R. R., 1984, "A Simple Refined Theory for Bending and Stretching of Homogeneous Plates," AIAA J., 22(1), pp. 90-95.
28. Valisetty, R. R., and Rehfield, L. W. 1983, "A Theory for Stress Analysis of Composite Laminates," AIAA Paper 83-0833-CP, 24thAIAA/ASME/ASCE/AHS Structures, Structural Dynamics and Materials Conference, Lake Tahoe, NV.
29. R. R., Valisetty, Mar. 1983, Bending of Beams, Plates and Laminates: Refined Theories and Comparative Studies, Ph.D. thesis, Georgia Institute of Technology, Atlanta, GA.
30. Hadjesfandiari, A. R., and Dargush, G. F., 2000, "Theory of Boundary Eigen-solutions in Engineering Mechanics," ASME J. Appl. Mech., 67, pp. 1-7.
31. Zhao, Y., Basaran, C., Cartwright, A., and Dishongh, T., 1999, "Thermomechanical Behavior of Micron Scale Solder Joints: An Experimental Observation," J. Mech. Behav. Mater., 10(3), pp. 135-146.
32. Zhao, Y., Basaran, C., Cartwright, C., and Dishongh, T., 2000, "Thermomechanical Behavior of Micron Scale Solder Joints Under Dynamic Loads," Mech. Mater., 32(3), pp. 161-173.