Analysis of thermomechanical interactions in a miniature solder system under cyclic fatigue loading

Journal of Electronic Materials

Volumn 28, Issue 9, 1999, Pages 1071-1077

  Hong, Bor Zen ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CYCLIC LOADS; EUTECTICS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PLASTIC DEFORMATION; SOLDERING; SOLDERING ALLOYS; STRAIN; STRESS ANALYSIS; THERMOMECHANICAL TREATMENT; VISCOPLASTICITY;

CHIP SCALE PACKAGES (CSP); THERMOMECHANICAL MINIATURE COUPLING;

ELECTRONICS PACKAGING;

EID: 0033361822     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-999-0185-9     Document Type: Article

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