High aspect ratio vertical through-vias for 3D MEMS packaging applications by optimized three-step deep RIE

Journal of the Electrochemical Society

Volumn 155, Issue 2, 2008, Pages

  Dixit, Pradeep ^a,b,c   Miao, Jianmin ^a,c  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^c ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; MEMS; OPTIMIZATION; PARAMETER ESTIMATION; SCANNING ELECTRON MICROSCOPY; THREE DIMENSIONAL;

BONDING INTERFACE; PLASMA ENERGY; VOID-FREE COPPER ELECTRODEPOSITION;

REACTIVE ION ETCHING;

EID: 37549062198     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2814081     Document Type: Article

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