Measurement of the thermomechanical strain of electronic devices by shearography

Microelectronics Reliability

Volumn 40, Issue 8-10, 2000, Pages 1509-1514

  Dilhaire, S ^a   Jorez, S ^a   Cornet, A ^b   Patino Lopez L D ^a   Claeys, W ^a  

^a UNIVERSITÉ DE BORDEAUX   (France)

^b UNIVERSITÉ CATHOLIQUE DE LOUVAIN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0008236216     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(00)00124-4     Document Type: Article

References (6)

1. Hung. "Shearography : a new optical method for strain measurement and non-destructive testing", Optical Engineering, (1982) vol. 21 n°3, pp 391-395.
2. Pfeifer, Mischo, Ettemeyer, "Strain/Stress Measurements using Electronic Speckle Pattern Interferometry", Proceeding of the SPIE, (1998) vol. 3520, pp 262-270.
3. B Sharp, "Electronic Speckle Pattern Interferometry (ESPI)", Optics and lasers in engineering, (1989) vol. 11, pp 241-255.
4. R Jones and C. Wykes. "Holographic and speckle interferometry". Cambridge University Press, Cambridge 1989
5. T. Kreis. "Holographic Interferometry: Principles and Methods". Berlin, Akademie Verlag, 1996
6. James and Tatam, "3D shearography for surface strain analysis", proceeding of the SPIE, (1999) vol. 3783, p247-256.