Enhanced 3-D folding of silicon microstructures via thermal shrinkage of a composite organic/inorganic bilayer

Journal of Microelectromechanical Systems

Volumn 17, Issue 4, 2008, Pages 882-889

  Wang, Ming Fang ^a   Maleki, Teimour ^a   Ziaie, Babak ^b  

^a PURDUE UNIVERSITY   (United States)

^b PURDUE UNIVERSITY   (United States)

Author keywords

3 D MEMS; Bilayer; Self assembly; Thermal actuator

Indexed keywords

BENDING (DEFORMATION); CURING; NONMETALS; POLYMERS; SHRINKAGE; SILICON; SILICON COMPOUNDS;

3-D MEMS; BENDING ANGLES; BI LAYERS; BILAYER; CURING TEMPERATURES; ORGANIC/INORGANIC; OUT-OF PLANE; POLY IMIDE; SELF-ASSEMBLY; SILICON MICROSTRUCTURES; TEMPERATURE-SENSITIVE; THERMAL ACTUATOR; V-GROOVES;

DRYING;

EID: 49149093124     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2008.926138     Document Type: Article

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