메뉴 건너뛰기





Volumn 3892, Issue , 1999, Pages 118-132

3D micromachined devices based on polyimide joint technology

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; BENDING (DEFORMATION); CURING; ELECTRIC CURRENTS; ELECTRIC LOSSES; HEATING EQUIPMENT; POLYIMIDES; SENSORS; SHRINKAGE; SILICON; THERMAL EXPANSION; WIRE;

EID: 0033318714     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (16)

References (49)
  • Reference 정보가 존재하지 않습니다.

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.