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Volumn 3892, Issue , 1999, Pages 118-132
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3D micromachined devices based on polyimide joint technology
a a a a |
Author keywords
[No Author keywords available]
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Indexed keywords
ACTUATORS;
BENDING (DEFORMATION);
CURING;
ELECTRIC CURRENTS;
ELECTRIC LOSSES;
HEATING EQUIPMENT;
POLYIMIDES;
SENSORS;
SHRINKAGE;
SILICON;
THERMAL EXPANSION;
WIRE;
POLYIMIDE JOINTS;
THREE DIMENSIONAL HOT-WIRE FLOW SENSORS;
THREE DIMENSIONAL MICROMACHINED DEVICES;
MICROMACHINING;
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EID: 0033318714
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (16)
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References (49)
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