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Volumn 47, Issue 3, 2000, Pages 281-289

A high-yield microassembly structure for three-dimensional microelectrode arrays

Author keywords

Active recording; Microassembly; Neural probe; Neural recording; Neural sensor; Orthogonal lead transfers; Three dimensional microstructure

Indexed keywords

BRAIN; CMOS INTEGRATED CIRCUITS; FUNCTIONAL NEURAL STIMULATION; MEDICAL APPLICATIONS; NEUROPHYSIOLOGY; PROBES; SENSORS; SIGNAL PROCESSING;

EID: 0034055301     PISSN: 00189294     EISSN: None     Source Type: Journal    
DOI: 10.1109/10.827288     Document Type: Article
Times cited : (219)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.