Thin films of MoN, WN, and perfluorinated silane deposited from dimethylamido precursors as contamination resistant coatings on micro-injection mold inserts

Surface and Coatings Technology

Volumn 202, Issue 21, 2008, Pages 5103-5109

  Miikkulainen, Ville ^a   Suvanto, Mika ^a   Pakkanen, Tapani A ^a   Siitonen, Samuli ^a   Karvinen, Petri ^a   Kuittinen, Markku ^a   Kisonen, Hannu ^b  

^a UNIVERSITY OF EASTERN FINLAND   (Finland)

^b Joensuu Science Park (IMTEC) Inc   (Finland)

Author keywords

Atomic layer deposition; Micro injection molding; Mold coating; Molybdenum nitride; Tungsten nitride

Indexed keywords

AMMONIA; ATOMIC LAYER DEPOSITION; CLADDING (COATING); COATINGS; CONTAMINATION; COPPER PLATING; CUBIC BORON NITRIDE; DIE CASTING INSERTS; ELECTROPLATING; FORMING; FRICTION; HEALTH; INJECTION (OIL WELLS); INJECTION MOLDING; MECHANICS; MICROFLUIDICS; MOLDING; MOLDS; MOLYBDENUM; NICKEL; NICKEL ALLOYS; NICKEL PLATING; NITRIDES; PIGMENTS; PLASTIC MOLDS; PLASTIC PRODUCTS; POLYMERS; PULSED LASER DEPOSITION; SILANES; SOLIDS; SURFACE PROPERTIES; TERNARY SYSTEMS; TESTING; THICK FILMS; THIN FILMS; TUNGSTEN; TUNGSTEN COMPOUNDS; VAPOR DEPOSITION;

(1 1 0) SURFACE; (ETHYLENE VINYL ALCOHOL) COPOLYMERS; (PL) PROPERTIES; ATOMIC LAYERS; DIMETHYLAMIDO; ELECTROPLATED NICKEL; ELSEVIER (CO); FRICTION COEFFICIENT (FC); GAS PHASE; INJECTION MOLDS; LOW COEFFICIENT OF FRICTION; MOLYBDENUM NITRIDES; PERFLUORINATED; PLASTIC MATERIALS; POLY(4 METHYL 1 PENTENE); SILANE COATINGS; TUNGSTEN NITRIDE (WN);

PLASTIC COATINGS;

EID: 46749092450     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2008.05.007     Document Type: Article

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