Process development and characterization of antisticking layers on nickel-based stamps designed for nanoimprint lithography

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 22, Issue 6, 2004, Pages 3283-3287

  Keil, M ^a   Beck, M ^a   Frennesson, G ^a   Theander, E ^a,b   Bolmsjo E ^a,b   Montelius, L ^b   Heidari, B ^a  

^a Box 580   (Sweden)

^b LUND UNIVERSITY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ADSORPTION; ATOMIC FORCE MICROSCOPY; BINDING ENERGY; DEPOSITION; ELECTROPLATING; NANOTECHNOLOGY; NICKEL; OXIDATION; PHOSPHORIC ACID; POLYCRYSTALLINE MATERIALS; SELF ASSEMBLY; THICKNESS MEASUREMENT; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

ANTISTICKING LAYERS; MONOMOLECULAR REGIONS; NANOIMPRINT LITHOGRAPHY (NIL); PLASMA CLEANING;

LITHOGRAPHY;

EID: 13244273823     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1824051     Document Type: Conference Paper

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