Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone). II. Chemorheological modeling

Journal of Applied Polymer Science

Volumn 66, Issue 4, 1997, Pages 799-808

  Wang, Qiang ^a   He, Tianbai ^b   Xia, Ping ^b   Chen, Tianlu ^b   Huang, Baotong ^b  

^a HEBEI UNIVERSITY OF TECHNOLOGY   (China)

^b Changchun Inst of Applied Chemistry ^*  (China)

Author keywords

Chemorheology; Composite; Epoxy resin; Model and simulation; Poly(phenylene ether ketone)

Indexed keywords

COMPUTER SIMULATION; CURING; DIFFERENTIAL SCANNING CALORIMETRY; MATHEMATICAL MODELS; POLYETHER ETHER KETONES; RHEOLOGY; TEMPERATURE; VISCOSITY;

BORON TRIFLUORIDE MONOETHYLAMINE; CHEMORHEOLOGY; DIAMINODIPHENYL SULFONE; STEPWISE TEMPERATURE;

EPOXY RESINS;

EID: 0031257922     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1097-4628(19971024)66:4<799::AID-APP20>3.0.CO;2-L     Document Type: Article

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