Surface Segregation of Al of the Bilayers of Pure Cu and Cu-Al Alloy Films

Journal of the Electrochemical Society

Volumn 148, Issue 9, 2001, Pages

  Wang, Pei I ^a   Murarka, S P ^a   Kaminski, D A ^a   Bedell, S ^b   Lanford, W A ^c  

^a RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

^c STATE UNIVERSITY OF NEW YORK   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0005576105     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1387239     Document Type: Article

References (14)

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