Texture of Cu and dilute binary Cu-alloy films: Impact of annealing and solute content

Materials Science in Semiconductor Processing

Volumn 6, Issue 4, 2003, Pages 175-184

  Barmak, K ^a   Gungor, A ^a   Rollett, A D ^a   Cabral Jr , C ^b   Harper, J M E ^b  

^a CARNEGIE MELLON UNIVERSITY   (United States)

^b IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Cu; Cu alloys; Texture; Thin Film

Indexed keywords

ANNEALING; BINARY ALLOYS; COPPER ALLOYS; ELASTIC MODULI; GRAIN GROWTH; HIGH TEMPERATURE EFFECTS; SILICON WAFERS; TEXTURES; THIN FILMS;

ALLOY CONCENTRATION;

MATERIALS SCIENCE;

EID: 0242573713     PISSN: 13698001     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1369-8001(03)00062-3     Document Type: Article

References (26)

1. Barmak K., Lucadamo G.A., Cabral C. Jr., Lavoie C., Harper J.M.E. J Appl Phys. 87:2000;2204-2214.
2. Barmak K., Lucadamo G.A., Cabral C. Jr., Lavoie C., Harper J.M.E. Mat Res Soc Symp Proc. 564:1999;341-346.
3. Barmak K., Gungor A., Rollett A.D., Cabral C. Jr., Harper J.M.E. Mat Res Soc Symp Proc. 721:2002;51-59.
4. Gungor A., Barmak K., Rollett A.D., Cabral C. Jr., Harper J.M.E. Mat Res Soc Symp Proc. 721:2002;60-65.
5. Gungor A., Barmak K., Rollett A.D., Cabral C. Jr., Harper J.M.E. Mat Sci Forum. 408-412:2002;1567-1572.
6. Gungor A., Barmak K., Rollett A.D., Cabral C. Jr., Harper J.M.E. J Vac Sci Technol B. 20:2002;2314-2319.
7. Barmak K, Gungor A, Rollett AD, Cabral C, Harper JME. unpublished.
8. Gungor A. Cu and Cu-alloy thin films: evolution of resistivity and microstructure. Ph.D. thesis, Carnegie Mellon University, Pittsburgh, 2002.
9. Knorr D.B., Tracy D.P., Rodbell K.P. Appl Phys Lett. 59:1991;3241-3243.
10. Tracy D.P., Knorr D.B., Rodbell K.P. J Appl Phys. 76:1994;2671-2680.
11. Zhou X.W., Wadley H.N.G. Acta Mater. 47:1999;1063-1078.
12. Kelland J.S., Kocks U.F., Rollett A.D., Wenk H-.R. Mater Sci Eng A. 132:1991;1-11.
13. Thompson C.V., Carel R. Mater Sci Eng B. 32:1995;211-219.
14. Thompson C.V. Annu Rev Mater Sci. 20:1990;245-268.
15. Rollett A.D., Srolovitz D.J., Anderson M.P. Acta Metall. 37:1989;1227-1240.
16. Rollett A.D., Mullins W.W. Scr Mater. 36:1997;975-980.
17. Grest G.S., Anderson M.P., Srolovitz D.J., Rollett A.D. Scr Metall Mater. 24:1990;661-665.
18. Demirel MC, Kuprat AP, George DC, Rollett AD. Phys Rev Lett 2003;90:016106-1-3.
19. Palumbo G., Lehocky E.M., Lin P. JOM. 50:1998;40-43.
20. Lehockey E.M., Palumbo G., Lin P., Brennenstuhl A. Metall Mater Trans. 29A:1998;387-396.
21. Randle V. The role of the coincidence site lattice in grain boundary engineering. London, UK: Institute of Materials; 1996. p. 120.
22. Humphreys FJ, Hatherly M. Recrystallization and related annealing phenomena. New York: Elsevier; 1996. pp. 314-325.
23. Zielinski E.M., Vinci R.P., Bravman J.L. J Appl Phys. 76:1994;4516-4523.
24. Jakkaraju R., Greer A.L. J Mater Sci: Mater Electron. 13:2002;285-294.
25. Gottstein G, Shvindlerman LS. Grain boundary migration in metals. CRC Series in Materials Science and Technology. Boca Raton, FL: CRC Press; 1999. p. 385.
26. Boutin F.R. J Phys. C4(10):1975;C4.355-C4.365.