CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - Interfacial reaction and bump shear strength

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 1, 2003, Pages 245-254

  Jang, Se Young ^a   Wolf, Juergen ^b   Ehrmann, Oswin ^b   Gloor, Heinz ^c   Schreiber, Thomas ^d   Reichl, Herbert ^b   Paik, Kyung Wook ^e  

^a SAMSUNG Electronics   (South Korea)

^b Fraunhofer Institute Reliability and Microintegration   (Germany)

^c Unaxis Semiconductors   (Germany)

^d Unaxis Semiconductors   (Germany)

^e Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Bump shear test; Electroplating; Flip chip; IMC; Pb 63Sn solder; UBM

Indexed keywords

CHROMIUM COMPOUNDS; ELECTROPLATING; FLIP CHIP DEVICES; INTERFACES (MATERIALS); INTERMETALLICS; METALLIZING; SHEAR STRENGTH; SOLDERING; SPUTTERING; SURFACE TENSION;

BUMP SHEAR TEST; CHEMICAL SOLDER DEPOSITION; ELECTROPLATING SOLDER BUMPING PROCESS; FLIP-CHIP INTERCONNECTION; UNDER BUMP METALLIZATION;

ELECTRONICS PACKAGING;

EID: 0038819078     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2002.807591     Document Type: Article

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