Next Generation Electronics Packaging Utilizing Flip Chip Technology

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2003, Pages 423-426

  Pascariu, Gheorghe ^a   Cronin, Peter ^a   Crowley, Daniel ^a  

^a A Newport Corporation Company   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COST EFFECTIVENESS; ELECTRONICS PACKAGING; LAPTOP COMPUTERS; TELEPHONE SETS; BONDING; COSTS; DIES; FLIP CHIP DEVICES; HAND HELD COMPUTERS; INDUSTRIAL ELECTRONICS; MANUFACTURE; MATERIALS HANDLING; MICROCOMPUTERS; PERSONAL COMPUTERS; PROCESS CONTROL; PRODUCT DESIGN; PRODUCTION;

HANDHELD TELEPHONES;

FLIP CHIP DEVICES; CHIP SCALE PACKAGES;

ELECTRONIC PACKAGING THERMAL MANAGEMENTS; FLIP CHIP; MICRO ASSEMBLY; PAPER TECHNOLOGY; PORTABLE COMPUTERS; TELEPHONY;

EID: 0141565326     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. Miquel, B., 'Flip Chip Underfill', Advanced Packaging, Vol 11, No. 8 (August 2002), p. 33.