Composition control for lead-free alloy electroplating on flip chip bumping

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 120-126

  Kiumi, R ^a   Takeda, S ^a   Yoshioka, J ^a   Kuriyama, F ^a   Saito, N ^a  

^a EBARA CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITION EFFECTS; COPPER; ELECTRIC POTENTIAL; ELECTROPLATING; LEAD; SILVER; SOLDERING ALLOYS;

COMPOSITION CONTROL; ELECTRIC POTENTIAL DISTRIBUTION; SN-PB SOLDER; SOLDER COMPOSITION;

FLIP CHIP DEVICES;

EID: 24644513993     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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