Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologies

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1850-1855

  Xiao, Guo Wei ^a   Gong, Jing Feng ^a   Yau, Esther W C ^a   Chan, Philip C H ^a   Lee, Ricky S W ^a   Yuen, Matthew M F ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROPLATING; ENERGY DISPERSIVE SPECTROSCOPY; FLIP CHIP DEVICES; MECHANICAL TESTING; MECHANICAL VARIABLES MEASUREMENT; METALLIZING; OPTICAL MICROSCOPY; PHOTORESISTS; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SPUTTER DEPOSITION;

SHEAR MEASUREMENT; SHEAR STRENGTH TESTING; SOLDER BUMPING; STENCIL PRINTING; UNDER BUMP METALLIZATION; ZINCATION PROCESS;

ELECTRONICS PACKAGING;

EID: 0038011615     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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