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Volumn , Issue , 2003, Pages 732-737
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Ultra-fine pitch Pb-free & eutectic solder bumping with fine particle size solder paste for nano packaging
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Author keywords
[No Author keywords available]
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Indexed keywords
DEPOSITION;
ELECTRONICS PACKAGING;
EUTECTICS;
LEAD;
PARTICLE SIZE;
SCREEN PRINTING;
SOLDERING;
CROSS SECTIONAL AREA;
DEPOSITION PROCESS;
ELECTRONIC COMPONENT;
ENVIRONMENTAL ISSUES;
SENSITIVE POLYMERS;
SOLDER BUMP VOLUME;
SOLDER DEPOSITION;
UNDER BUMP METALLIZATION;
LEAD-FREE SOLDERS;
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EID: 84954039395
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/EPTC.2003.1271614 Document Type: Conference Paper |
Times cited : (7)
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References (6)
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