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Volumn , Issue , 2003, Pages 732-737

Ultra-fine pitch Pb-free & eutectic solder bumping with fine particle size solder paste for nano packaging

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; ELECTRONICS PACKAGING; EUTECTICS; LEAD; PARTICLE SIZE; SCREEN PRINTING; SOLDERING;

EID: 84954039395     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271614     Document Type: Conference Paper
Times cited : (7)

References (6)
  • 4
    • 0035493762 scopus 로고    scopus 로고
    • Comparison of electroplated eutectic Bi/Sn and Pb/Sn solder bumps on Various YBM systems
    • October
    • Se-Young Jang and Kyung Wook Paik, "Comparison of electroplated eutectic Bi/Sn and Pb/Sn solder bumps on Various YBM systems", IEEE transactions of Electronics Packaging Manufacturing, Vol.24, No.4, October 2001.
    • (2001) IEEE Transactions of Electronics Packaging Manufacturing , vol.24 , Issue.4
    • Jang, S.-Y.1    Paik, K.W.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.