Ultra-fine pitch Pb-free & eutectic solder bumping with fine particle size solder paste for nano packaging

Proceedings of 5th Electronics Packaging Technology Conference, EPTC 2003

Volumn , Issue , 2003, Pages 732-737

  Kripesh, V ^a   Kwan, Wong Wai ^a   Iyer, M ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; ELECTRONICS PACKAGING; EUTECTICS; LEAD; PARTICLE SIZE; SCREEN PRINTING; SOLDERING;

CROSS SECTIONAL AREA; DEPOSITION PROCESS; ELECTRONIC COMPONENT; ENVIRONMENTAL ISSUES; SENSITIVE POLYMERS; SOLDER BUMP VOLUME; SOLDER DEPOSITION; UNDER BUMP METALLIZATION;

LEAD-FREE SOLDERS;

EID: 84954039395     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2003.1271614     Document Type: Conference Paper

References (6)

1. International Technology Roadmap for Semiconductors, 2001 and 2003 Update.
2. Waste electrical and electronic equipment (WEEE) directive of European Parliament & Council, 2003.
3. th Electronics Components Technology Conference, Orlando, FL, May 1996, pp. 546-551.
4. Se-Young Jang and Kyung Wook Paik, "Comparison of electroplated eutectic Bi/Sn and Pb/Sn solder bumps on Various YBM systems", IEEE transactions of Electronics Packaging Manufacturing, Vol.24, No.4, October 2001.
5. Li Li and Pat Thomspson, "Stencil Printing Process development for Flip Chip Interconnect", IEEE transactions on Electronics Packaging Manufacturing, Vol. 23, No. 3, July 2000
6. Peter Elenius, Jim Leal, Joe Ney, David Stepniak and Shing Yeh, "Recent Advances in Flip Chip wafer bumping using solder paste technology", Proceeding of Electronic Components and Technology Conference 1999.