Approaching a uniform bump height of the electroplated solder bumps on a silicon wafer

IEEE Transactions on Components Packaging and Manufacturing Technology Part B

Volumn 19, Issue 4, 1996, Pages 747-751

  Lin, Kwang Lung ^a   Chang, Shiuh Yuan ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Bump height; Electroplating; Flip chip; Reflow; Solder bump

Indexed keywords

CURRENT DENSITY; ELECTRODES; ELECTROLYTIC CELLS; ELECTROPLATING; FLIP CHIP DEVICES; SOLDERED JOINTS;

BUMP HEIGHT; ELECTROPLATED SOLDER BUMPS;

SILICON WAFERS;

EID: 0030285449     PISSN: 10709894     EISSN: None     Source Type: Journal    
DOI: 10.1109/96.544365     Document Type: Article

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