Integrating through-wafer interconnects with active devices and circuits

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 1, 2008, Pages 4-13

  Jozwiak, Jim ^a,b   Southwick III, Richard G ^c   Johnson, Vaughn N ^c   Knowlton, William B ^c   Moll, Amy J ^c  

^a BOISE STATE UNIVERSITY   (United States)

^b MICRON TECHNOLOGY INC   (United States)

^c Boise State University   (United States)

Author keywords

Integrated circuit (IC) packaging; Interconnects

Indexed keywords

ELECTRONICS PACKAGING; MASKS; MICROELECTRONICS; MICROPROCESSOR CHIPS;

THROUGH WAFER INTERCONNECTS;

INTEGRATED CIRCUITS;

EID: 40549139509     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.906235     Document Type: Article

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