3-D packaging: Where all technologies come together

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn 29, Issue , 2004, Pages 64-67

  Karnezos, Marcos ^a  

^a ChipPAC Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CELL PHONES; SINGLE-DIE PACKAGES; WAFER THINNING;

APPLICATION SPECIFIC INTEGRATED CIRCUITS; DYNAMIC RANDOM ACCESS STORAGE; MICROPROCESSOR CHIPS; PERSONAL DIGITAL ASSISTANTS; SOLDERING ALLOYS; THERMAL CYCLING;

ELECTRONICS PACKAGING;

EID: 4644301667     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. Karnezos, M, "Package-in-Package (PiP): A new 3-D Module for Wireless Applications", MEPTEC Symposium on "SIPs or SOCs? The Multi-million Dollar Question" Proceedings, The Westin Santa Clara, CA, Feb. 19, 2004.