Isotropic etch for SiO2 microcantilever release with ICP system

Microelectronic Engineering

Volumn 85, Issue 3, 2008, Pages 500-507

  Chen, Qi ^a   Fang, Ji ^a   Ji, Hai Feng ^a   Varahramyan, Kody ^a  

^a LOUISIANA TECH UNIVERSITY   (United States)

Author keywords

Dry isotropic etching; Release process and ICP isotropic etch; SiO2 microcantilever

Indexed keywords

ANISOTROPIC ETCHING; DRY ETCHING; PLASMA SOURCES;

DRY ISOTROPIC ETCHING; ISOTROPIC ETCH; MICROCANTILEVERS; RELEASE PROCESS;

SILICA;

EID: 38949172099     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.09.004     Document Type: Article

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