Bosch deep silicon etching: Improving uniformity and etch rate for advanced MEMS applications

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 1999, Pages 211-216

  Laermer, F ^a   Schilp, A ^a   Funk, K ^a   Offenberg, M ^a  

^a ROBERT BOSCH GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

MICROELECTROMECHANICAL DEVICES; SILICON WAFERS;

DEEP SILICON ETCHING;

ETCHING;

EID: 0032636883     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)