A modified Bosch-type process for precise surface micromachining of polysilicon

Journal of Micromechanics and Microengineering

Volumn 12, Issue 3, 2002, Pages 328-333

  Quevy E ^a   Parvais, B ^b   Raskin, J P ^b   Buchaillot, L ^a   Flandre, D ^b   Collard, D ^c  

^a INSTITUT D ELECTRONIQUE   (France)

^b UNIVERSITÉ CATHOLIQUE DE LOUVAIN   (Belgium)

^c UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPY; ETCHING; INDUCTIVELY COUPLED PLASMA; LITHOGRAPHY; MICROMACHINING; PASSIVATION; THIN FILMS;

MICROMECHANICAL STRUCTURES;

POLYSILICON;

EID: 0036572386     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/12/3/320     Document Type: Article

References (11)

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7. Etch rates for micromachining processing
8. Etching of Si with C12 using an electron cyclotron resonance source
9. Bosch deep silion etching: Improving uniformity and etch rate for advanced MEMS applications