Thermal furnace and Ultraviolet assisted curing impact on SiOCH spin-on ultra low dielectric constant materials

Thin Solid Films

Volumn 516, Issue 6, 2008, Pages 1097-1103

  Zenasni, A ^a   Remiat, B ^a   Waldfried, C ^c   Le Cornec, Ch ^a   Jousseaume, V ^a   Passemard, G ^b  

^a CEA LETI   (France)

^b STMICROELECTRONICS   (France)

^c AXCELIS TECHNOLOGIES   (United States)

Author keywords

Curing; SiOCH; Spin on; ULK; UV

Indexed keywords

CROSSLINKING; CURING; PERMITTIVITY; POROSITY; POROUS MATERIALS; REACTION KINETICS;

FILM STRUCTURES; MATRIX CROSSLINKINGS; METAL LINES; THERMAL FURNACE;

DIELECTRIC MATERIALS;

EID: 37349003180     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.05.010     Document Type: Article

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