UV-assisted processing for advanced dielectric films

Solid State Technology

Volumn 48, Issue 3, 2005, Pages 43-48

  Dhamadhikari, Vineet ^a   Sims, J S ^a   Varadarajan, B ^a   Chang, S ^a   Niu, D ^a   Shrinivasan, K ^a  

^a NOVELLUS SYSTEMS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FILM-MODIFICATION; LOW-PRESSURE CHEMICAL VAPOR DEPOSITION (LPCVD); THERMAL BUDGET; ULTRAVIOLET-ASSISTED THERMAL PROCESSING (UVTP);

ADHESION; CAPACITANCE; CHEMICAL BONDS; DIELECTRIC FILMS; DIFFUSION; LIGHT ABSORPTION; LOW TEMPERATURE EFFECTS; OPTIMIZATION; PHOTONS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; STRENGTH OF MATERIALS; THERMAL EFFECTS;

ULTRAVIOLET RADIATION;

EID: 15844398635     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (6)

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2. A. Lauwers, M. de Potter, O. Chamirian, R. Lindsay, C. Demeurisse, et al., "Suicides for the 100nm Node and Beyond: Co - silicide, Co (Ni)-silicide and Ni-silicide," Microelectronic Engineering, Vol. 64, p.131, 2002.
3. K. Maex, M.R. Baklanov, D. Shamiryan, F. Iacopi, S.H. Brongersma, et al., "Low Dielectric Constant Materials for Microelectronics," J. Appl. Phys., Vol. 93, p. 8793, 2003.
4. A. Grill, D.A. Neumayer, "Structure of Low Dielectric Constant to Extreme Low Dielectric Constant SiCOH Films: Fourier Transform Infrared Spectroscopy Characterization," J. Appl. Phys., Vol. 94, p. 6697, 2003.
5. R.N. Vrtis, M.L. O'Neill, J.L. Vicent, A.S. Lukas, B.K. Peterson, et al., "Plasma Enhanced Chemical Vapor Deposition of Porous Organosilicate Glass ILD Films With k < 2.4," Proc. MRS Symp., Vol. 766, p. 259, 2003.
6. G. Xu, J. He, E. Andideh, J. Bielefeld, T. Scherban, "Cohesive Strength Characterization of Brittle Low-k Films," Proc. IITC, p. 57, 2002.