Understanding CMP-induced delamination in Ultra Low-k/Cu integration

Proceedings of the IEEE 2005 International Interconnect Technology Conference, IITC

Volumn , Issue , 2005, Pages 209-211

  Leduc, P ^a   Savoye, M ^a   Maitrejean, S ^a   Scevola, D ^b   Jousseaume, V ^a   Passemard, G ^b  

^a CEA LETI   (France)

^b STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COPPER; DELAMINATION; DIELECTRIC MATERIALS; ELASTIC MODULI; INTERFACES (MATERIALS); POROUS MATERIALS;

ADHESION FAILURE; FRICTION CHARACTERIZATION;

CHEMICAL MECHANICAL POLISHING;

EID: 28244435875     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Kondo et al., Proceedings of IITC 2003, IEEE, pp 86-88, 2003
2. T. Scherban et al., Proceedings of IITC 2001, IEEE, pp 257-259, 2001
3. A. Bourgeois et al., Thin Solid Films, 455-56, 366, 2004
4. S. Maitrejean et al., Proceedings of IITC 2002, IEEE, 2002
5. P. Leduc et al., Proceedings of VMIC 2004, pp 120-125, 2004