Microstructure and mechanical properties of Ti-Si-C-N films synthesized by plasma-enhanced chemical vapor deposition

Surface and Coatings Technology

Volumn 202, Issue 4-7, 2007, Pages 915-919

  Abraham, Sudeep ^a   Choi, Eun Young ^a   Kang, Namhyun ^a   Kim, Kwang Ho ^a  

^a Pusan National University   (South Korea)

Author keywords

Friction coefficient; Microhardness; PECVD; Silicon content; Ti Si C N

Indexed keywords

FRICTION; MECHANICAL PROPERTIES; METALLOGRAPHIC MICROSTRUCTURE; MICROHARDNESS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICON WAFERS; STAINLESS STEEL; SYNTHESIS (CHEMICAL);

COMPOSITE MICROSTRUCTURE; MICROSTRUCTURE AND MECHANICAL MODIFICATION;

TITANIUM ALLOYS;

FRICTION; MECHANICAL PROPERTIES; METALLOGRAPHIC MICROSTRUCTURE; MICROHARDNESS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SILICON WAFERS; STAINLESS STEEL; SYNTHESIS (CHEMICAL); TITANIUM ALLOYS;

EID: 36049047067     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2007.05.073     Document Type: Article

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