Study of nanocrystalline TiN/Si3N4 thin films deposited using a dual ion beam method

Thin Solid Films

Volumn 485, Issue 1-2, 2005, Pages 148-154

  Colligon, J S ^a   Vishnyakov, V ^a   Valizadeh, R ^a   Donnelly, S E ^b   Kumashiro, S ^b  

^a MANCHESTER METROPOLITAN UNIVERSITY   (United Kingdom)

^b UNIVERSITY OF SALFORD   (United Kingdom)

Author keywords

Hardness; Ion bombardment; Nanostructures; Physical vapour deposition; Silicon nitride; Titanium nitride

Indexed keywords

ANNEALING; CHEMICAL BONDS; HARDNESS; HIGH RESOLUTION ELECTRON MICROSCOPY; ION BEAMS; ION BOMBARDMENT; NANOSTRUCTURED MATERIALS; PHYSICAL VAPOR DEPOSITION; SILICON NITRIDE; THERMODYNAMIC STABILITY; TITANIUM NITRIDE; TRANSMISSION ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

ION-ASSIST ENERGY; MATERIAL STRUCTURE; NANOCOMPOSITE NITRIDES; PERCOLATION NETWORKS;

THIN FILMS;

EID: 21244465432     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2005.03.036     Document Type: Article

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