-
1
-
-
35348902338
-
-
Abaqus Documentation, Dynamic Failure Models, Abaqus Analysis User's Manual, Version 6.6, Section 18.2.8, 2006.
-
Abaqus Documentation, Dynamic Failure Models, Abaqus Analysis User's Manual, Version 6.6, Section 18.2.8, 2006.
-
-
-
-
2
-
-
35348905908
-
-
Abaqus Documentation, Cohesive Elements, Abaqus Analysis User's Manual, Version 6.6, Section 26.5, 2006.
-
Abaqus Documentation, Cohesive Elements, Abaqus Analysis User's Manual, Version 6.6, Section 26.5, 2006.
-
-
-
-
3
-
-
35348870806
-
-
Abaqus Documentation, Finite Elements and Rigid Bodies, Getting Started with Abaqus Explicit: Keywords Version, Version 6.5, Section 4.1, 2005
-
Abaqus Documentation, Finite Elements and Rigid Bodies, Getting Started with Abaqus Explicit: Keywords Version, Version 6.5, Section 4.1, 2005.
-
-
-
-
4
-
-
35348895384
-
-
Abaqus Documentation, Beam Element Overview, Abaqus Theory Manual, Version 6.5, Section 3.5.1, 2005.
-
Abaqus Documentation, Beam Element Overview, Abaqus Theory Manual, Version 6.5, Section 3.5.1, 2005.
-
-
-
-
5
-
-
11244331550
-
Fatigue damage modeling in solder interconnects using a cohesive zone approach
-
Abdul-Baqi, A., Schreurs, P. J. G., Geers, M. G. D., Fatigue damage modeling in solder interconnects using a cohesive zone approach, International Journal of Solids and Structures, Volume 42, pp. 927-942, 2005.
-
(2005)
International Journal of Solids and Structures
, vol.42
, pp. 927-942
-
-
Abdul-Baqi, A.1
Schreurs, P.J.G.2
Geers, M.G.D.3
-
6
-
-
24644440545
-
Flexural Strength of BGA Solder Joints With ENIG Substrate Finish Using 4-Point Bend Test
-
Bansal, A., Yoon, S., Mahadev, V., Flexural Strength of BGA Solder Joints With ENIG Substrate Finish Using 4-Point Bend Test, SMTA Pan Pacific Microelectronics Symposium, pp. 1-8, 2005.
-
(2005)
SMTA Pan Pacific Microelectronics Symposium
, pp. 1-8
-
-
Bansal, A.1
Yoon, S.2
Mahadev, V.3
-
7
-
-
33845584150
-
A Novel Technique for Modeling Solder Joint Failure During System Level Drop Simulations
-
Carroll, D., Bates, C., Zampino, M., Jones, K., A Novel Technique for Modeling Solder Joint Failure During System Level Drop Simulations, Proceedings of ITHERM, pp. 861-868, 2006.
-
(2006)
Proceedings of ITHERM
, pp. 861-868
-
-
Carroll, D.1
Bates, C.2
Zampino, M.3
Jones, K.4
-
8
-
-
24644500322
-
Drop Level Drop Test Reliability of IC Packages
-
Chai, T. C., Quek, S., Hnin, W. Y., Wong, E. H., Drop Level Drop Test Reliability of IC Packages, Electronic Components and Technology Conference, pp. 630-636, 2005.
-
(2005)
Electronic Components and Technology Conference
, pp. 630-636
-
-
Chai, T.C.1
Quek, S.2
Hnin, W.Y.3
Wong, E.H.4
-
9
-
-
10444246545
-
Impact Reliability of Solder Joints
-
Date, M., Shoji, T., Fujiyoshi, M., Sato, K., Tu, K. N., Impact Reliability of Solder Joints, Electronic Components and Technology Conference, pp. 668-674, 2004.
-
(2004)
Electronic Components and Technology Conference
, pp. 668-674
-
-
Date, M.1
Shoji, T.2
Fujiyoshi, M.3
Sato, K.4
Tu, K.N.5
-
10
-
-
33845567943
-
Interface Failure in Lead Free Solder Joints
-
Darveaux, R., Reichman, C., Islam, N., Interface Failure in Lead Free Solder Joints, Electronic Components and Technology Conference, pp. 906-917, 2006.
-
(2006)
Electronic Components and Technology Conference
, pp. 906-917
-
-
Darveaux, R.1
Reichman, C.2
Islam, N.3
-
11
-
-
0033335125
-
Shear Testing and Failure Mode Analysis for Evaluation of BGA Ball Attachment
-
Erich, R., Coyle, J. R., Wenger, G. M., Primavera, A., Shear Testing and Failure Mode Analysis for Evaluation of BGA Ball Attachment, Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology Symposium, pp. 16-22, 1999.
-
(1999)
Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology Symposium
, pp. 16-22
-
-
Erich, R.1
Coyle, J.R.2
Wenger, G.M.3
Primavera, A.4
-
12
-
-
28444450896
-
Equivalent Solder Joint and Equivalent Layer Models for the Simulation of Solder Column Failure under Drop Impact
-
Gu, J., Lim, C. T., Tay, A. A. O., Equivalent Solder Joint and Equivalent Layer Models for the Simulation of Solder Column Failure under Drop Impact, Electronic Components and Technology Conference, pp. 547-552, 2004.
-
(2004)
Electronic Components and Technology Conference
, pp. 547-552
-
-
Gu, J.1
Lim, C.T.2
Tay, A.A.O.3
-
13
-
-
24644450280
-
Simulation of Mechanical Response of Solder Joints under Drop Impact Using Equivalent Layer Models
-
Gu, J., Lim, C. T., Tay, A. A. O., Simulation of Mechanical Response of Solder Joints under Drop Impact Using Equivalent Layer Models, Electronic Components and Technology Conference, pp. 491-498, 2005.
-
(2005)
Electronic Components and Technology Conference
, pp. 491-498
-
-
Gu, J.1
Lim, C.T.2
Tay, A.A.O.3
-
14
-
-
33845561924
-
Enhancing Drop Test Efficacy for Product Quality Improvement through Interconnection Shear Tests
-
Hanabe, M., Canumalla, S., Kujala, A., Enhancing Drop Test Efficacy for Product Quality Improvement through Interconnection Shear Tests, Electronic Components and Technology Conference, pp. 83-88, 2006.
-
(2006)
Electronic Components and Technology Conference
, pp. 83-88
-
-
Hanabe, M.1
Canumalla, S.2
Kujala, A.3
-
15
-
-
0038688691
-
Analysis of Solder Joint Fracture under Mechanical Bending Test
-
Harada, K., Baba, S., Wu, Q., Matsushima, H., Matsunaga, T., Uegai, Y., Kimura, M., Analysis of Solder Joint Fracture under Mechanical Bending Test, Electronic Components and Technology Conference, pp. 1731-1737, 2003.
-
(2003)
Electronic Components and Technology Conference
, pp. 1731-1737
-
-
Harada, K.1
Baba, S.2
Wu, Q.3
Matsushima, H.4
Matsunaga, T.5
Uegai, Y.6
Kimura, M.7
-
16
-
-
33845598287
-
Solder-Joint Reliability in Electronics Under Shock and Vibration using Explicit Finite-Element Sub-modeling
-
Lall, P., Gupte, S., Choudhary, P., Suhling, J., Solder-Joint Reliability in Electronics Under Shock and Vibration using Explicit Finite-Element Sub-modeling, Electronic Components and Technology Conference, pp. 428-435, 2006.
-
(2006)
Electronic Components and Technology Conference
, pp. 428-435
-
-
Lall, P.1
Gupte, S.2
Choudhary, P.3
Suhling, J.4
-
17
-
-
10444248113
-
Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact
-
Lall, P., Panchagade, D., Liu, Y., Johnson, W., Suhling, J., Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact, Electronic Components and Technology Conference, pp. 1296-1303, 2004.
-
(2004)
Electronic Components and Technology Conference
, pp. 1296-1303
-
-
Lall, P.1
Panchagade, D.2
Liu, Y.3
Johnson, W.4
Suhling, J.5
-
18
-
-
24644451676
-
Failure Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging
-
Lall, P., Panchagade, D., Choudhary, P., Suhling, J., Gupte, S., Failure Envelope Approach to Modeling Shock and Vibration Survivability of Electronic and MEMS Packaging, Electronic Components and Technology Conference, pp. 480-490, 2005.
-
(2005)
Electronic Components and Technology Conference
, pp. 480-490
-
-
Lall, P.1
Panchagade, D.2
Choudhary, P.3
Suhling, J.4
Gupte, S.5
-
19
-
-
0038690050
-
Drop Impact Survey of Portable Electronic Products
-
Lim, C.T., Ang, C.W., Tan, L.B., Seah, S.K.W., Wong, E.H., Drop Impact Survey of Portable Electronic Products, Electronic Components and Technology Conference, pp.113-120, 2003.
-
(2003)
Electronic Components and Technology Conference
, pp. 113-120
-
-
Lim, C.T.1
Ang, C.W.2
Tan, L.B.3
Seah, S.K.W.4
Wong, E.H.5
-
20
-
-
0036296703
-
Investigating the Drop Impact of Portable Electronic Products
-
Lim, C.T., Low, Y.J., Investigating the Drop Impact of Portable Electronic Products, Electronic Components and Technology Conference, pp. 1270-1274, 2002.
-
(2002)
Electronic Components and Technology Conference
, pp. 1270-1274
-
-
Lim, C.T.1
Low, Y.J.2
-
21
-
-
0023410904
-
A Continuum Model for Void Nucleation by Inclusion Debonding
-
Needleman, A., A Continuum Model for Void Nucleation by Inclusion Debonding, Journal of Applied Mechanics, Volume 54, pp. 525-531, 1987.
-
(1987)
Journal of Applied Mechanics
, vol.54
, pp. 525-531
-
-
Needleman, A.1
-
22
-
-
0024982575
-
An analysis of decohesion along an imperfect interface
-
Needleman, A., An analysis of decohesion along an imperfect interface , International Journal of Fracture, Volume 42, pp. 21-40, 1990.
-
(1990)
International Journal of Fracture
, vol.42
, pp. 21-40
-
-
Needleman, A.1
-
24
-
-
10444237197
-
Dynamic Materials Testing and Modeling of Solder Interconnects
-
Ong, K. C., Tan, V. B. C., Lim, C. T., Wong, E. H., Zhang, X. W., Dynamic Materials Testing and Modeling of Solder Interconnects, Electronic Components and Technology Conference, pp. 1075-1079, 2005.
-
(2005)
Electronic Components and Technology Conference
, pp. 1075-1079
-
-
Ong, K.C.1
Tan, V.B.C.2
Lim, C.T.3
Wong, E.H.4
Zhang, X.W.5
-
25
-
-
10444285597
-
Shell-Based Simplified Electronic Package Model Development and its Application for Reliability Analysis
-
Ren, W., Wang, J., Shell-Based Simplified Electronic Package Model Development and its Application for Reliability Analysis, Electronic Packaging Technology Conference, pp. 217-222, 2003.
-
(2003)
Electronic Packaging Technology Conference
, pp. 217-222
-
-
Ren, W.1
Wang, J.2
-
26
-
-
28444432753
-
Application of ABAQUS/Explicit Submodeling Technique in Drop Simulation of System Assembly
-
Ren, W., Wang, J., Reinikainen, T., Application of ABAQUS/Explicit Submodeling Technique in Drop Simulation of System Assembly, Electronic Packaging Technology Conference, pp. 541-546, 2004.
-
(2004)
Electronic Packaging Technology Conference
, pp. 541-546
-
-
Ren, W.1
Wang, J.2
Reinikainen, T.3
-
28
-
-
35348814739
-
Modeling crack growth using local process zones
-
Technical report, GKSS research centre, Geesthacht
-
Schwalbe, K.-H., Cornec, A., Modeling crack growth using local process zones. Technical report, GKSS research centre, Geesthacht, 1994.
-
(1994)
-
-
Schwalbe, K.-H.1
Cornec, A.2
-
29
-
-
0038690051
-
Board Level Drop Test and Simulation of TFBGA Packages for Telecommunication Applications
-
Tee, T. Y., Ng, H. S., Lim, C.T., Pek, E., Zhong, Z., Board Level Drop Test and Simulation of TFBGA Packages for Telecommunication Applications, Electronic Components and Technology Conference, pp. 121-129, 2003.
-
(2003)
Electronic Components and Technology Conference
, pp. 121-129
-
-
Tee, T.Y.1
Ng, H.S.2
Lim, C.T.3
Pek, E.4
Zhong, Z.5
-
30
-
-
16344384568
-
A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces
-
Towashiraporn, P., Subbarayan, G., Desai, C. S., A hybrid model for computationally efficient fatigue fracture simulations at microelectronic assembly interfaces, International Journal of Solids and Structures, Volume 42, pp. 4468-4483, 2005.
-
(2005)
International Journal of Solids and Structures
, vol.42
, pp. 4468-4483
-
-
Towashiraporn, P.1
Subbarayan, G.2
Desai, C.S.3
-
31
-
-
33845588989
-
Cohesive Modeling of Solder Interconnect Failure in Board Level Drop Test
-
Towashiraporn, P., Xie, C., Cohesive Modeling of Solder Interconnect Failure in Board Level Drop Test, Proceedings of ITHERM, pp. 817-825, 2006.
-
(2006)
Proceedings of ITHERM
, pp. 817-825
-
-
Towashiraporn, P.1
Xie, C.2
-
32
-
-
44049109778
-
The relation between crack growth resistance and fracture process parameters in elastic-plastic solids
-
Tvergaard, V., Hutchinson, J.W., The relation between crack growth resistance and fracture process parameters in elastic-plastic solids, Journal of the Mechanics and Physics of Solids, Volume 40, pp. 1337-1397, 1992
-
(1992)
Journal of the Mechanics and Physics of Solids
, vol.40
, pp. 1337-1397
-
-
Tvergaard, V.1
Hutchinson, J.W.2
-
33
-
-
24644457303
-
Drop Impact: Fundamentals & Impact Characteristics of Solder Joints
-
Wong, E. H., Rajoo, R., Mai, Y. W., Seah, S. K. W., Tsai, K. T., Yap, L. M., Drop Impact: Fundamentals & Impact Characteristics of Solder Joints, Electronic Components and Technology Conference, pp. 1202-1209, 2005.
-
(2005)
Electronic Components and Technology Conference
, pp. 1202-1209
-
-
Wong, E.H.1
Rajoo, R.2
Mai, Y.W.3
Seah, S.K.W.4
Tsai, K.T.5
Yap, L.M.6
-
34
-
-
0031625149
-
Drop/Impact Simulation and Test Validation of Telecommunication Products
-
Wu, J., Song, G., Yeh, C., Wyatt, K., Drop/Impact Simulation and Test Validation of Telecommunication Products, InterSociety Conference on Thermal Phenomena, pp. 330-336, 1998.
-
(1998)
InterSociety Conference on Thermal Phenomena
, pp. 330-336
-
-
Wu, J.1
Song, G.2
Yeh, C.3
Wyatt, K.4
-
35
-
-
0038351732
-
Modeling Technique for Reliability Assessment of Portable Electronic Product Subjected to Drop Impact Loads
-
Zhu, I., Modeling Technique for Reliability Assessment of Portable Electronic Product Subjected to Drop Impact Loads, Electronic Components and Technology Conference, pp. 100-104, 2003.
-
(2003)
Electronic Components and Technology Conference
, pp. 100-104
-
-
Zhu, I.1
-
36
-
-
0348198989
-
Submodeling Technique for BGA Reliability Analysis of CSP Packaging Subjected to an Impact Loading
-
Zhu, L., Submodeling Technique for BGA Reliability Analysis of CSP Packaging Subjected to an Impact Loading, InterPACK Conference Proceedings, pp. 1401-1409, 2001.
-
(2001)
InterPACK Conference Proceedings
, pp. 1401-1409
-
-
Zhu, L.1
|