Application of ABAQUS/explicit submodeling technique in drop simulation of system assembly

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 541-546

  Ren, Wei ^a   Wang, Jianjun ^a   Reinikainen, Tommi ^b  

^a NOKIA RESEARCH CENTER   (United States)

^b NONE   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; MATHEMATICAL MODELS; SOLDERED JOINTS;

IMPACT ANALYSIS; SYSTEM ASSEMBLY DROP SIMULATION;

ELECTRONICS PACKAGING;

EID: 28444432753     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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3. Simon, B.R., Y. Yuan, J.R. Umaretiya, R. Bavirisetty, and J.L. Prince, "Thermal and Mechanical Finite Element Analysis of a VLSI Package Including Spatially Varying Thermal Contact Resistance," Sixth IEEE SEMI-THERM Symposium, 1990, pp. 74-81.
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7. Zhu, J., S. Quander, and T. Reinikainen, "Global/Local Modeling for PWB Mechanical Loading," Proceeding of IEEE ECTC, 2001, pp.1164-1169.
8. Zhu, L., "Sumodeling Technique for BGA Reliability Analysis of CSP Packaging Subjected to an Impact Loading," Proceedings of InterPACK Conference, 2001.
9. Ren, Wei, and J. Wang " Shell-Based Simplified Electronic Package Model Development And Its Application For Reliability Analysis, " Proceeding of EPTC, Singapore, 2003, pp.217-222.