Simulation of mechanical response of solder joints under drop impact using equivalent layer models

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 491-498

  Gu, Jie ^a   Lim, C T ^a   Tay, Andrew A O ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CONTINUUM LAYERS; DROP IMPACT; EQUIVALENT LAYER MODELS; MECHANICAL RESPONSE;

ANISOTROPY; COMPUTER SIMULATION; CONTINUUM MECHANICS; ELECTRONICS PACKAGING; IMPACT TESTING;

SOLDERED JOINTS;

EID: 24644450280     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Tong Yan Tee, Hun Shen Ng, Chwee Tee Lim, Eric Pek, Zhaowei Zhong, "Board Level Drop Test and Simulation of TFBGA Packages for Telecommunication Applications", 2003 Electronic Components and Technology Conference
2. Sogo T., Hara S., "Estimation of Fall Impact Strength for BGA Solder Joints" ICEP Conference Proceedings, Japan, 2001, pp. 369-373
3. Gu Jie, Chwee Teck Lim, Andrew A.O. Tay, "Equivalent Solder Joint and Equivalent Layer Models for the Simulation of Solder Column Failure under Drop Impact", 6th EPTC Conference, Singapore, 2004
4. J.M.Pitarresi, D.V.Caletka, "The 'Smeared' property Technique for the FE Vibration Analysis of Printed Circuit Cards", Journal of Electronic Packaging, Vol. 113, September 1991
5. Gu Jie, Chwee Teck Lim, Andrew A.O. Tay, "Simulation of the Failure of Solder Columns due to the PCB Bending under Drop Impact", 6th EPTC Conference, Singapore, 2004
6. S.G. Lekhnitskii, Anisotropic Plates, Gordon and Breach, Science Publishers, 1956
7. ABAQUS Theory manual