Submodeling technique for BGA reliability analysis of CSP packaging subjected to an impact loading

Advances in Electronic Packaging

Volumn 2, Issue , 2001, Pages 1401-1409

  Zhu, Liping ^a  

^a ERICSSON RESEARCH   (Sweden)

Author keywords

BGA reliability; FEA; Impact load; Submodeling

Indexed keywords

COMPUTER SOFTWARE; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; LOADS (FORCES); LOGIC DESIGN; MATHEMATICAL MODELS; RELIABILITY; SOLDERING;

BALL GRID ARRAYS (BGA); SHOCK LOADING;

ELECTRONICS PACKAGING;

EID: 0348198989     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Darveaux, R., 2000, "Effect of Simulation Methodology on Solder Joint Crack Growth Correlation," Proceeding of IEEE ECTC, 2000, pp. 1048-1058.
2. Darveaux, R. and Syed, A., 2000, "Reliability of Area Array Solder Joints in Bending," Surface Mount Technology Association International.
3. th International LS-DYNA Users Conference 2000, pp. 11-17 to 11-26.
4. Hallquist, J. O., 1994, LS-DYNA Theoretical Manual, LSTC, California.
5. Shi, X. Q., Pang, H. J., Zhou, W., and Wang, Z. P., 1999, "Temperature and Strain Rate Effect on Mechanical Properties of 63Sn/37Pb Solder Alloy," Advances in Electronic Packaging, ASME 1999, 26-1, pp. 551-557.
6. Zukas, J. A., 1994, "Numerical simulation of high rate behavior," Shock and Impact on Structures, editor by Brebbia, C. A., pp. 1-26.