Equivalent solder joint and equivalent layer models for the simulation of solder column failure under drop impact

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004

Volumn , Issue , 2004, Pages 547-552

  Jie, Gu ^a   Lim, C T ^a   Tay, A A O ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; MATHEMATICAL MODELS;

DROP IMPACT; SOLDER JOINT MODEL;

SOLDERED JOINTS;

EID: 28444450896     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Tong Yan Tee, Hun Shen Ng, Chwee Tee Lim, Eric Pek, Zhaowei Zhong, "Board Level Drop Test and Simulation of TFBGA Packages for Telecommunication Applications", 2003 Electronic Components and Technology Conference
2. Sogo T., Hara S., "Estimation of Fall Impact Strength for BGA Solder Joints" ICEP Conference Proceedings, Japan, 2001, pp. 369-373
3. J.M.Pitarresi, A.A.Primavera, "Comparison of Modeling Technique for the Vibration Analysis of Printed Circuit Cards", ASME Journal of Electronics Packaging, Vol.114, December, pp.378-383
4. E. H. Wong, K. M. Lim, Norman Lee, Simon Seah, Cindy Hoe, Jason Wang, "Drop Impact Test - Mechanics & Physics of Failure", 4th EPTC Conference, Singapore, 2002, pp.327-333
5. Gu Jie, Chwee Teck Lim, Andrew A.O. Tay, "Simulation of the Failure of Solder Columns due to the PCB Bending under Drop Impact", 6th EPTC Conference, Singapore, 2004