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Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference
Volumn 2006, Issue , 2006, Pages 817-825
Cohesive modeling of solder interconnect failure in board level drop test
Author keywords

Cohesive; Crack propagation; Drop; Failure; Finite element analysis; Impact; Solder
Indexed keywords

COHESIVE; DROPS; IMPACT; SOLDER INTERCONNECTS;
EID: 33845588989     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645431     Document Type: Conference Paper
Times cited : (26)
References (10)
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  • 3
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    • Simulation of mechanical response of solder joints under drop impact using equivalent layer models
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  • 4
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    • BGA britlle fracture-alternative solder joint integrity test methods
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  • 5
    • 33845563459 scopus 로고    scopus 로고
    • A hybrid fracture-damage model for computationally efficient fracture simulations in solder joints
    • Towashiraporn et al., "A Hybrid Fracture-Damage Model for Computationally Efficient Fracture Simulations in Solder Joints", Int. Journal of Solids and Structures, In press
    • Int. Journal of Solids and Structures, in Press
    • Towashiraporn1
  • 6
    • 11244331550 scopus 로고    scopus 로고
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    • Abdul-Baqi et al., "Fatigue Damage Modeling in Solder Interconnects using a Cohesive Zone Approach", Int. Journal of Solids and Structures; 42 (2005), pp. 927-942
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  • 7
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    • Solder tensile test material modeling
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.