SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 36, Issue 11, 2007, Pages 1469-1475

Morphological and microstructural evolution of phosphorous-rich layer in SnAgCu/Ni-P UBM solder joint

(4) Lin, Yung Chi a Shih, Toung Yi a Tien, Shih Kang a Duh, Jenq Gong a

a NATIONAL TSING HUA UNIVERSITY (Taiwan)

Author keywords

Electron microscope; Lead free solder; Ni x P y compound; Ni Sn P; Phase transformation; Quantitative analysis

Indexed keywords

FIELD EMISSION ELECTRON PROBE MICROANALYZERS (FE-EPMA); LEAD FREE SOLDERS; SELECTED AREA DIFFRACTION (SAD); UNDER BUMP METALLIZATION (UBM);

CHEMICAL ANALYSIS; ELECTRON MICROSCOPES; METALLIZING; MICROSTRUCTURE; MORPHOLOGY; PHASE TRANSITIONS; PHOSPHORUS; SOLDERED JOINTS;

TIN COMPOUNDS;

EID: 35248820639 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-007-0253-y Document Type: Conference Paper

Times cited : (21)

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