Phenomena of electroless Ni-P and intermetallic-compound stripping and dissolving in Sn-Bi and Sn-Pb solder joints with Au/EN/Cu metallization

Journal of Electronic Materials

Volumn 31, Issue 11, 2002, Pages 1230-1237

  Huang, Chien Sheng ^a   Yeh, Jih Hung ^a   Young, Bi Lian ^a   Duh, Jenq Gong ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Electroless Ni P; Intermetallic compound; Stripping; Under bump metallurgy

Indexed keywords

ALUMINA; ANNEALING; COATINGS; COPPER; FLIP CHIP DEVICES; INTERMETALLICS; METALLIZING; METALLURGY; OXIDATION; PHOSPHORUS; TIN ALLOYS;

INTERFACIAL REACTION; UNDER-BUMP METALLURGY;

SOLDERING ALLOYS;

EID: 0036865876     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-002-0014-x     Document Type: Article

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