Elimination of the corrosion of Ni-P substrates during electroless gold plating

Journal of the Electrochemical Society

Volumn 152, Issue 4, 2005, Pages

  Shaigan, N ^a   Ashrafizadeh, S N ^a   Bafghi, M S H ^a   Rastegari, S ^a  

^a IRAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Iran)

Author keywords

[No Author keywords available]

Indexed keywords

CONCENTRATION (PROCESS); COPPER; CORROSION; CYANIDES; DEPOSITION; DIFFUSION; ELECTROCHEMISTRY; GOLD PLATING; PH EFFECTS; POLARIZATION; SHEAR STRENGTH;

CORROSION PROCESS; GALVANIC DISPLACEMENT; GOLD FILMS; SURFACE CORROSION;

NICKEL ALLOYS;

EID: 18344387359     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1862269     Document Type: Article

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