The effect of high magnetic field on the growth behavior of Sn-3Ag-0.5Cu/Cu IMC layer

Scripta Materialia

Volumn 54, Issue 6, 2006, Pages 1077-1080

  Zhao, Jie ^a   Yang, Peng ^a   Zhu, Feng ^a   Cheng, Cong Qian ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Aging; High magnetic field; Intermetallic compounds; Kinetics; Solder

Indexed keywords

AGING OF MATERIALS; COPPER COMPOUNDS; CRYSTAL ORIENTATION; GRAIN GROWTH; INTERMETALLICS; MAGNETIC FIELD EFFECTS; SILVER COMPOUNDS; SOLDERING ALLOYS;

GROWTH BEHAVIOR; KINETICS;

TIN;

EID: 30744435871     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2005.12.005     Document Type: Article

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