A comparative study on the crystallization behavior of electroless Ni-P and Ni-Cu-P deposits

Surface and Coatings Technology

Volumn 148, Issue 2-3, 2001, Pages 143-148

  Yu, Hui Sheng ^a   Luo, Shou Fu ^a   Wang, Yong Rui ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

B Phase transition; C Electroless deposition; D Phosphides; X Ni Cu P

Indexed keywords

AMORPHOUS MATERIALS; COPPER; CRYSTALLIZATION; DIFFERENTIAL SCANNING CALORIMETRY; EUTECTICS; NICKEL; PHOSPHORUS; X RAY DIFFRACTION ANALYSIS;

HYPEREUTECTIC AMORPHOUS DEPOSITS;

ELECTROLESS PLATING;

CRYSTALLIZATION;

EID: 0035803960     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(01)01345-7     Document Type: Article

References (18)