Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder

Journal of Electronic Materials

Volumn 35, Issue 1, 2006, Pages 7-14

  Lin, Yung Chi ^a   Duh, Jenq Gong ^a   Chiou, B I Shiou ^b  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

Electroplated Ni P; Interfacial reaction; Lead free solder; Under bump metallurgy (UBM); Wettability

Indexed keywords

COPPER; METALLURGY; NICKEL PLATING; PHOSPHORUS; SILVER; SOLDERING ALLOYS; TIN;

ELECTROPLATED NI-P; INTERFACIAL REACTION; LEAD-FREE SOLDER; UNDER BUMP METALLURGY (UBM); WETTABILITY;

ELECTROPLATING;

EID: 32644453890     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0177-y     Document Type: Conference Paper

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