Effect of interfacial reactions on the reliability of lead-free assemblies after board level drop tests

Journal of Electronic Materials

Volumn 36, Issue 9, 2007, Pages 1129-1136

  Xia, Yanghua ^a   Lu, Chuanyan ^b   Xie, Xiaoming ^a  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b DaimlerChrysler SIM Technology Co Ltd   (China)

Author keywords

Drop test; Intermetallic compounds; Lead free solder joint; Microstructure; Reliability

Indexed keywords

DROP TESTS; ELECTROLESS NICKEL IMMERSION GOLD (ENIG); LEAD-FREE SOLDER JOINTS; ORGANIC SOLDERABILITY PRESERVATIVE (OSP);

INTERMETALLICS; MICROSTRUCTURE; PRINTED CIRCUIT BOARDS; RELIABILITY THEORY; SURFACE CHEMISTRY;

SOLDERED JOINTS;

EID: 34548278957     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0186-5     Document Type: Article

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