On the formation of Cu-Ni-Sn ternary intermetallics in SMT solder joints

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04

Volumn , Issue , 2004, Pages 66-69

  Chang, Junling ^a   Xia, Yanhhua ^a   Xie, Xiaoming ^a,b  

^a SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY   (China)

^b DaimlerChrysler SIM Technology Co Ltd   (China)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER ALLOYS; DIFFUSION; ENERGY DISPERSIVE SPECTROSCOPY; METALLIZING; SANDWICH STRUCTURES; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; TERNARY SYSTEMS;

ORGANIC SOLDERABILITY PRESERVATIVE (OSP); SNPB/NI INTERFACE; SOLDER JOINT THICKNESS; TERNARY ALLOYS;

INTERMETALLICS;

EID: 14844333279     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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