Reliability evaluations of chip interconnect in lead-free solder systems

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1275-1280

  Guo, Yifan ^a   Lin, Jong Kai ^a   De Silva, Anada ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

LEAD-FREE SOLDER SYSTEMS; UNDER BUMP METALLURGY (UBM);

FLIP CHIP DEVICES; INTERMETALLICS; METALLURGY; MICROPROCESSOR CHIPS; SOLDERING ALLOYS; TENSILE STRESS; THERMAL CYCLING;

LARGE SCALE SYSTEMS;

EID: 0036292856     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2002.1008270     Document Type: Conference Paper

References (4)

1. Chip-to-package interconnections
2. Solder joint reliability of flip chip assemblies
3. Failure mechanisms of SnPb and Pb-free flip chip solder interconnects under tensile stress
4. Stress/strength and reliability evaluations of interconnect in different solder systems