Finite element modeling of electronic packages subjected to drop impact

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 3, 2005, Pages 555-560

  Tan, V B C ^a   Tong, M X ^a   Lim, Kian Meng ^a   Lim, Chwee Teck ^a  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Ball grid array (BGA); Drop impact; Finite element (FE) simulation

Indexed keywords

COMPUTER SIMULATION; DEGREES OF FREEDOM (MECHANICS); FINITE ELEMENT METHOD; IMPACT TESTING; INTEGRATED CIRCUIT TESTING; MATHEMATICAL MODELS; PRINTED CIRCUIT TESTING; SOLDERING ALLOYS; THREE DIMENSIONAL;

BALL GRID ARRAY (BGA) PACKAGE; DROP IMPACT; FINITE ELEMENT (FE) SIMULATION; INTERCONNECTING SOLDER BALLS;

ELECTRONICS PACKAGING;

EID: 27644563678     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848580     Document Type: Article

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