Metallurgical reactions of Sn-3.5Ag solder with various thicknesses of electroplated Ni/Cu under bump metallization

Journal of Materials Research

Volumn 20, Issue 10, 2005, Pages 2772-2779

  Huang, Chang Pin ^a   Chen, Chih ^a   Liu, C Y ^b   Lin, S S ^c   Chen, K H ^c  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b NATIONAL CENTRAL UNIVERSITY   (Taiwan)

^c MEGIC Technology   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; ELECTROPLATING; EUTECTICS; FRACTURE; GRAIN GROWTH; INTERMETALLICS; METALLIZING; MICROELECTRONICS; NICKEL; SHEAR STRENGTH; TIN ALLOYS; TIN METALLURGY;

BUMP METALLIZATION; METALLURGICAL REACTIONS; SHEAR TEST; SOLID STATE REACTION;

SOLDERING ALLOYS;

EID: 29144505101     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2005.0334     Document Type: Article

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