Lead-free plastic area array BGAs and polymer stud grid arrays™ package reliability

Microelectronics Reliability

Volumn 41, Issue 11, 2001, Pages 1829-1839

  Wojciechowski, Dominique ^a,b   Chan, Moses ^a   Martone, Fabrizio ^a  

^a Alcatel Microelectronics ^*  (Belgium)

^b LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EUTECTICS; INJECTION MOLDING; MICROELECTRONIC PROCESSING; PACKAGING; POLYMERS; STUDS (FASTENERS);

BALL GRID ARRAYS (BGA); POLYMER STUDS;

PLASTICS;

PLASTICS;

EID: 0035501165     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(01)00089-0     Document Type: Conference Paper

References (19)

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3. Lead-free components
4. Impact on BGAs, process and equipments of lead-free soldering
5. Lead-free solders for surface mount technology applications
6. CIMID, a technology for high density integration of electronic systems
7. The polymer stud grid array (PSGA™) package: A thermal fatigue reliability study, IMAPS Nordic
8. Effect on thermal fatigue reliability of decreasing the pitch of PSGA packages from 0.8 to 0.3 mm
9. Reliability assessment for the polymer stud grid array (PSGA™) package
10. Lead-free solder BGAs and polymer stud grid arrays
11. Effect of high thermal stability mold material on the gold-aluminium bond reliability in epoxy encapsulated VLSI devices
12. The impact of moisture diffusion during solder reflow on package reliability
13. Lead-free soldering for CSP - The impact of higher temperature SMT assembly processing
14. Reliability of lead-free BGA packages